Finance More open source, more intelligent | 2025 Fibocom & Qualcomm closed-door technical exchange successfully held
Shenzhen, July 25, 2025 /PRNewswire/ -- Driven by the continuous evolution of artificial intelligence, the accelerated application of large models, and the increasingly mature edge computing architecture, smart terminals are moving towards a new stage of higher performance, stronger perception, and higher openness. The "2025 Qualcomm Smart IoT Technology Day" co-organized by Fibocom and Qualcomm was successfully held in Shenzhen on July 24. With the theme of "More Open Source, More Intelligent", this closed-door exchange meeting brought together experts from multiple fields to focus on the development trend of deep integration of AI and the industry, and promote the accelerated evolution of the smart IoT ecosystem.
At the opening of the event, Qualcomm Global Vice President Hou Mingjuan delivered a speech, reviewing how Qualcomm integrates global innovation resources in the AIoT field to serve local market needs, and emphasized that Qualcomm will continue to work with ecosystem partners and developers to build an open, collaborative, efficient and sustainable AIoT industry ecosystem.
Then, Fibocom CEO Ying Lingpeng delivered a speech. He said that Fibocom actively embraces the development trend of AI, relying on Qualcomm's leading chip platform and technological advantages to accelerate the commercial deployment of AI solutions, and work with more partners to promote the large-scale application of edge intelligence.
Subsequently, Li Dalong, Product Marketing Director of Qualcomm, delivered a speech entitled "Open Collaboration, Intelligent Empowerment - Unleashing the Infinite Possibilities of Edge Intelligence". He pointed out that artificial intelligence is accelerating the reshaping of innovation paths in all walks of life. Qualcomm relies on the newly launched Qualcomm Dragonwing brand to help customers efficiently build and deploy AI products and achieve large-scale expansion of edge and terminal intelligence.
In "From Hearing to Understanding: Qualcomm's Application Practice in End-side Speech Recognition and Large Language Model", Yang Fan, a senior engineer at Qualcomm, shared in detail how Qualcomm is continuously enhancing the perception and understanding capabilities of smart terminals through cutting-edge lightweight model optimization and end-side speech recognition technology. With a more efficient model deployment strategy, Qualcomm is pushing voice interaction from "being able to hear" to "being able to understand", creating a smart voice solution with faster response and more natural interaction for customers, helping end-side AI achieve a qualitative leap.
Zhao Yi, Vice President of Fibocom MC Product Management Department, focused on "AI Solution Innovation, Driving the Industry to Win the Future", and systematically introduced three AI product series for different scenarios and forms: the Nebula series focusing on scenarios such as unmanned retail and conference translation, the AI Buddy series for portable smart terminals, supporting cloud/end collaborative architecture, and the FiboVista series focusing on algorithm deployment, covering core applications such as audio and video processing. He emphasized that Fibocom is promoting the standardized output of AI capabilities and building a flexible and replicable AI commercial ecosystem through software and hardware integration and platform collaboration.
Tao Xi, Vice President of MBB Product Management Department of Fibocom, delivered a keynote speech titled "5G+AI Leading Industry Change, Working Together to Create the Future", focusing on the development of the FWA market and sharing the "FWA Pro+FWA Lite" product matrix strategy to meet diverse connection scenarios. He highlighted the "TianQing FWA AI Solution", which integrates Modem AI SDK, Gen AI SDK and FIBO xOS platform to build an AI home/enterprise computing power center.
Liu Ziwei, director of Fibocom AI Research Institute, shared "Cloud Symbiosis, Intelligent Computing Driven: Analysis of Fibocom's Full-Stack AI Capabilities", showing Fibocom's accumulation of capabilities in device-side AI and cloud-side AI, as well as the implementation of visual, auditory, multi-modal, and large language model interactions. He proposed that Fibocom's AI capabilities have been integrated with industry solutions and have been gradually put into commercial use, accelerating the release of value in various smart terminals.
Finally, Li Bangzhu, founder of the AI Product List, gave a keynote speech on "2025 Global AI Product Trends and Hardware Innovation Insights". He deeply analyzed the development trends of global AI products, focused on typical application scenarios of hardware innovation, and brought new ideas for AI integration into the industry.
There are also a variety of exhibits and technology demo experience areas on site, where guests can closely experience the innovative application results of Fibocom AI solutions and Qualcomm platform solutions in smart terminals. In the future, Fibocom will continue to work with Qualcomm to promote the deep integration of AI and IoT with more open and smarter industry solutions, and help the industry's intelligent transformation to a new level.