More Open • More Intelligent: 2025 Grand Tech & Qualcomm Closed-door Technology Exchange Successfully Held
July 25, 2025, Shenzhen / PRNewswire / -- With artificial intelligence (AI) continuing to advance, large models accelerating application, and edge computing architectures becoming increasingly mature, smart terminals are poised for a new phase of higher performance, stronger sensing capabilities, and greater openness. The "2025 Qualcomm Intelligent IoT Technology Day" jointly hosted by Grand Tech and Qualcomm was held successfully on July 24th in Shenzhen. This closed-door exchange event centered around the theme of "More Open • More Intelligent," gathering experts from multiple fields to focus on the trend of AI deep fusion with industries, driving the acceleration of intelligent IoT ecosystem evolution.
At the opening, Qualcomm's Global Vice President, Hou Mingjuan, delivered a speech, reviewing how Qualcomm integrated global innovation resources to serve local market demands and emphasizing that Qualcomm would continue to work with partners and developers to build an open, collaborative, efficient, and sustainable AIoT industry ecosystem.
Subsequently, Grand Tech's CEO, Yingpeng Yang, delivered a speech. He emphasized that Grand Tech actively embraced AI development trends, leveraging Qualcomm's leading chip platforms and technology advantages to accelerate the commercial deployment of AI solutions and work with more partners to promote edge intelligence's scaled application.
Later, Qualcomm's Product Marketing Director, Li Daren, delivered a lecture titled "Open Collaboration, Wisdom Empowerment — Unlocking the Unlimited Possibilities of Edge Intelligence." He pointed out that artificial intelligence was accelerating the reshaping of innovation pathways in various industries, and Qualcomm would help customers build and deploy AI products efficiently, achieving scaled expansion of edge and terminal intelligence.
Qualcomm's Senior Engineer, Yang Fan, shared a lecture titled "From Understanding to Wisdom: Qualcomm's Applications of Edge Speech Recognition and Large Language Models." He detailed how Qualcomm was optimizing front-edge models and edge speech recognition technologies to continuously enhance the sensing and understanding capabilities of intelligent terminals. With more efficient deployment strategies, Qualcomm promoted voice interaction from "understanding" to "wisdom," creating a response time that is faster, more natural, and smarter for customers.
Grand Tech's Vice President of MC Product Management, Zhao Yi, introduced a lecture titled "AI Solution Innovation, Driving Industrial Wisdom." He systematically presented three AI product series targeting different scenarios and forms: the StarCloud series focused on unmanned retail and meeting translation; the AI Buddy series supported cloud-end collaboration architectures for portable intelligent terminals; and the FiboVista series emphasized algorithm deployment and covered core applications such as audio-video processing. He stressed that Grand Tech was promoting AI capabilities through hardware-software integration and platform collaboration, building a flexible and replicable AI commercial ecosystem.
Grand Tech's Vice President of MBB Product Management, Tao Xi, brought the topic "5G+AI Leading Industry Transformation, Hand in Hand with Same-Sense Creation Future." He focused on FWA market development, sharing the "FWA Pro+FWA Lite" product matrix strategy to meet diverse connection scenarios. He particularly introduced "Tianyin FWA AI Solutions," which integrated Modem AI SDK, Gen AI SDK, and FIBO xOS platforms to build an AI-powered home/enterprise hub.
Grand Tech's Institute of Artificial Intelligence Director, Liu Zhiwei, shared a lecture titled "Cloud-End Harmony, Wisdom Empowerment: Grand Tech Full-Stack AI Capability Analysis." He showcased Grand Tech's accumulation of edge AI and cloud AI capabilities, as well as visual, auditory, multimodal, and large language model interactions. He proposed that Grand Tech AI capabilities integrated industrial solutions had been gradually commercialized, accelerating the release of value in various intelligent terminals.
Finally, AI Product Rankings Founder, Li Bing, brought a lecture titled "2025 Global AI Product Trends and Hardware Innovation Insights." He deeply analyzed global AI product development trends, focusing on hardware innovation applications for attendees to bring new insights to the AI fusion industry.
A rich exhibition area and technical demo experience zone were also set up at the event site, allowing guests to closely experience Grand Tech's AI solutions and Qualcomm platform solutions in intelligent terminals. In the future, Grand Tech will continue to work with Qualcomm to promote more open, more intelligent industry solutions, driving AI and IoT deep fusion, and helping industries transform into smart heights.